Die Bonder Hybrid, DATACON - 2200 evo
Vintage 2016, Gen3
1.
Location, CMTec AG, Switzerland
2.
EVO Generation, Generation 3
3.
Software version, on request
4.
Operation system, on request
5.
Condition, refurbished
6.
Wafermapping, Yes
7.
Single Component Tracking, Yes
8.
Vintage, 2016
Main System
10.
Bondhead, Standard
11.
Time-pressure dispenser, Yes
12.
Volumetric dispenser, no / on request
13.
Musashi dispenser, no / on request
14.
Substrate camera, Yes
15.
Toolbank, Yes 7 position
16.
Squeegee unit, no / on request
17.
Flipchip unit, no / on request
18.
Fluxslider, no / on request
19.
Wafertable, Yes, 6 to 12 inch
20.
Wafer magazine lift, Yes
21.
Wafercamera, Yes
22.
Ejector system, Yes
23.
Ejector carusell, Yes
24.
Uplooking camera, Yes
25.
Static wafflepack holder, no / on request
ID System
26.
Bondhead, No
27.
Time-pressure dispenser, Yes
28.
Volumetric dispenser, no / on request
29.
Musashi dispenser, no / on request
30.
Substrate camera, Yes
31.
Squeegee unit, No
Transport system
standart Type one
32.
Inputbuffer, no / on request
33.
Outputbuffer, no / on request
34.
Input magazine handler, no / on request
35.
Output magazine handler, no / on request
Customized options
P-Parts, no / on request
36.
Heated P-Part, no / on request
37.
Process related tools, no / on request
38.
Calibration & Service tools, no / on request
configuration as required.
